In addition to custom assembly, EI Microcircuits provides a full range of support services. By utilizing these services on a contract basis, you can reduce overhead expenses, respond quickly to work overloads, access specific technical assistance, and eliminate inventory costs and rotation problems through EI-sourced components.

Through analysis of existing bills of material, EI Microcircuits can determine where surface mount devices can be cost-effectively substituted for leaded components. Components may be supplied from your consigned inventory or sourced through EI's extensive component library, which in turn can provide additional flexibility in inventory cost control and management.

Utilizing a high-speed CAD system and internally-developed, state-of-the-art SM design rules, EI can quickly generate reliable high-density circuit and component layouts which are compatible with automated pick-and-place equipment. Production-ready 1:1 film sets are provided for all elements of the PCB and assembly fixtures.

EI Microcircuits personnel have been designing and building hybrid assemblies since 1982. Our engineering staff has over 60 years of collective experience in circuit design, packaging, and custom PCB assembly. This expertise provides the fine-tuning essential to achieving optimum product quality and total system cost reduction.

EI can assist your design staff in many areas:

1) Determination of pad size, conductor routing, and component spacing and arrangement.
2) Circuit partitioning for lowest testable module, SIP, or DIP packages.
3) PCB and SM thermal expansion analysis.
4) Step and repeat panel design for small PCBs.
5) Evaluation of board materials, processing, and tooling.
6) Product redesign for maximum savings and size and weight reduction.

EI's production facilities are well-appointed, clean, and under full process control.

Our state-of-the-art computer-controlled assembly and in-line process equipment provide efficient, repeatable, and reliable assembly from unit to unit—each time a job lot is run.

Our capabilities include single- and double-sided assemblies using mixed technology and a variety of substrate materials. Board dipping, coating, and potting processes are also available.

Our equipment and process successfully assemble all component types, from 0402 chip packages to odd-form components to fine-pitch ICs, Ball Grid Arrays (BGA) and Chip Scale Packages (CSP).

Our robotic pick-and-place equipment can support large volume runs and provide zero defect placement for all components suitable for surface mount. Components may be supplied by tape feeders, stick magazine feeders, or vibratory bulk feeders.

Throughout the assembly process, EI utilizes AOI (Automated Optical Inspection), real-time X-ray, and endoscopy (ERSA Scope), as well as numerous visual inspection stations.

EI Microcircuits provides ICT and functional circuit testing. These can be supplemented with test equipment provided by your QC department to ensure compatibility with product specifications.